The biggest difference between the manufacturing of MEMS products and the classical IC is that it contains mechanical parts, and the packaging process accounts for the majority of the cost of the whole device. If the device failures are detected after the final packaging, not only the cost is wasted, but also the R&D, process and manufacturing time are wasted. Early product function testing, reliability analysis and failure analysis can reduce product cost and accelerate the time to market, which is very important for the industrialization of micro-electromechanical systems.